API uses the Aquastorm cleaning system, providing a unique impingement pattern; cleaning even the most challenging flux residues.
Products.
Build to Print
API’s expertise covers state-of-the-art microelectronic techniques and technologies including:
- Micro BGAs
- Die bonding
- Fluxless DAP Soldering
- 1-3 mil Gold Ball Bonding
- Automatic wedge bonding
- Automated PCB assembly
- In-house thin film fabrication
- Fully automated over temperature testing
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API's Build to Print Automated Element Attach capabilities focus on the same high quality process control that our ISO 9001:2000... |
API's ability to achieve total vertical integration draws its success from our diverse group of more than 35 engineers dedicated to... |
API’s void-free precision millimeter-wave bonding techniques maintains maximum die-to-substrate surface contact eliminating poor... |
API offers Primary Encapsulation, or Glob Top Dispensing, a Build to Print technique where a specific amount of resin is deposited... |
Build to Print Fluxless Soldering by API, removes oxides from substrates and inhibits further oxidation insuring both intimate substrate... |
Choosing the right New Product Introduction (NPI) partner ensures a smooth process from “Concept to Completion.” Innovating companies... |
API specializes in Wirebonding whether it be Automatic Gold Ball Bonding or Automatic Aluminum Wedge Bonding. API also offers... |
